深圳市宝星微科技有限公司

PART NUMBER: W25Q80DVSSIG                                                   Document Date: 2015/05/19 
Winbond certifies that the above part number product is in compliance with Halogen Free (IEC 61249-2-21), European RoHS (EU Directive 2011/65/EU), China RoHS, and Level 1 of SONY SS-00259 requirements.

華邦保證以上產品型號符合無鹵素(IEC61249-2-21), 歐盟RoHS指令(指令2011/65/EU), 中國電子資訊產品污染控制管理辦法 及索尼SS-00259第一級管理物質之規定

Banned Substance Analysis Result 
                                                                                                                             Analysis reports reference 
Material                         Pb       Cd       Hg      CrVI      PBB     PBDE       Br       Cl       Report Date 
                                                                                                                                      number 
Mold Compound (Material I)       <2       <2       <2       <2        <2       <2      <50      <50        2015/3/27               KA/2015/31311 
                                                                                                                                  CE/2015/38127 
Mold Compound (Material II)      <2       <2       <2       <2        <2       <2      <50      <50        2015/4/15              CE/2015/38129 
                                                                                                                                  CE/2015/38130 
                                                                                                                                  CE/2014/70614 
Die Attached (Material I)        <2       <2       <2       <2       <2        <2      <50      <50         2014/7/8              CE/2014/70611 
                                                                                                                                  CE/2014/70615 
                                                                                                                                  CE/2014/70632 
Die Attached (Material II)       <2       <2       <2       <2       <2        <2      <50      <50         2014/7/8              CE/2014/70629 
                                                                                                                                  CE/2014/70633 
Die Attached (Material III)      <2       <2       <2       <2       <2        <2      <50      <50        2014/10/13             CE/2014/A0235A 
                                                                                                           2015/4/27               KA/2015/40272 
Leadframe                        <2       <2       <2       <2        <2       <2      <50       NA 
                                                                                                           2015/1/20               KA/2015/10661 
Tin Plating (Material I)        <13.4     <2       <2       <2       <2        <2      <50       NA        2014/8/19               KA/2014/80590

Tin Plating (Material II)        <4       <2       <2       <2       <2        <2      <50       NA         2015/1/6            CANEC1421601903

Bond Wire (Material I)           <2       <2       <2       <2       <2        <2       NA       NA        2014/11/18             KA/2014/B0714

Bond Wire (Material II)          <2       <2       <2       <2       <2        <2       NA       NA        2014/10/22             CE/2014/A2568

Chip                             <2       <2       <2       <2       <2        <2      <50      <50        2014/10/27             CE/2014/A3352

* Unless otherwise noted, units are in PPM (parts-per-million)

* NA: Not applicable

* Third party analysis reports are available upon request through our sales representative 
*  如您需要進一步分析報告, 請聯絡本公司銷售代表 
European Union’s Restriction on Use of Hazardous Substances (“RoHS”) 
                      RoHS Restricted Substances                                                  Threshold, Homogeneous Level

Cadmium (Cd)                                                                                                 <  100 ppm

Hexavalent Chromium (CrVI)                                                                                    < 1000 ppm

Lead (Pb)                                                                                                    < 1000 ppm

Mercury (Hg)                                                                                                 < 1000 ppm

Polybrominated Biphenyls (PBBs)                                                                               < 1000 ppm

Polybrominated Diphenyl Ethers (PBDEs)                                                                       < 1000 ppm

Halogen Free Specifications (IEC 61249-2-21,JPCA-ES01 2003, IPC 4101) 
                     Halogen Restricted Substances                                                Threshold, Homogeneous Level

Chlorine (Cl)                                                                                                 < 900 ppm

Bromine (Br)                                                                                                  < 900 ppm

Total concentration of Bromine (Br) +Chlorine (Cl)                                                           < 1500 ppm

Signature:

Name/Title:                   Jing-Fong Tsai 
                              Vice-President, Quality Assueance and ESH Center